SK Hynix Deepens Collaboration with Japanese Memory Partners, Advances HBM Packaging Base in the U.S.
SK Hynix CEO Kwak Noh-Jung stated that the company is exploring ways to deepen cooperation with Japanese memory chip customers and suppliers, while assessing joint development opportunities in the NAND flash market. Following Toshiba's divestment, SK Hynix's investment vehicle BCPE Pangea Cayman2 has become Kioxia's largest shareholder, holding a 14.19% stake. SK Hynix holds bonds convertible into nearly all voting rights of this investment vehicle, with voting rights capped at 15% until 2028. Additionally, SK Hynix is investing over $4 billion in Indiana, USA, to build an HBM packaging facility, with cleanroom operations expected to commence in October 2028. The next generation of HBM is planned for mass production in the second half of 2029, and once fully operational, the facility is expected to employ around 1,000 people. The company is still evaluating the possibility of an IPO for its U.S. NAND subsidiary Solidigm, but no decision has been made yet.
-- Price
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